Advanced Materials
High-thermal-conductivity metal-matrix composites with controlled thermal expansion for demanding electronic and optoelectronic applications
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PRODUCT OVERVIEW
High-thermal-conductivity metal-matrix composites with controlled thermal expansion for demanding electronic and optoelectronic applications
Applications
The confirmed material family is used as a heat-spreader solution where high thermal conductivity and controlled expansion are required
IGBT / high-power electronics
Microwave devices
Optoelectronics
Phased-array radar
High-energy solid-state lasers
High-power electronic thermal management
Supply Forms / Customization
Thermal conductivity and expansion are selected by grade and material design rather than generalized from one product
Thermal conductivity: approximately 500–1100 W/(m·K), depending on grade and design
CTE can be tailored within the confirmed source range
Thickness: approximately 0.5 mm to several centimeters
Au and Ni surface coatings available
Holes, steps, curved features and other complex shapes can be produced to requirement
KEY TECHNICAL DATA
Confirmed Grades
| Grade | Density (g/cm³) | Thermal Conductivity (W/(m·K)) | CTE (×10⁻⁶/K) | Flexural Strength (MPa) |
|---|---|---|---|---|
| CDW-270-30 | 7.21 | ≥500 | 5.5–7.5 | ≥320 |
| CDW-100-50 | 6.05 | 700–1000 | 4.1–6.7 | ≥300 |
| CDW-100-60 | 5.31 | 800–1100 | 4.0–6.2 | ≥300 |
| ADW-100-55 | 3.18 | ≥800 | 5.1–9.3 | ≥380 |
Sample / RFQ
Share the target conductivity, CTE, dimensions, coating and application conditions